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Knowledge Transfer Initiatives

Latest Events

2016

APAC Innovation Summit 2016 Series – Advanced Materials & Printed Electronics

Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of advanced materials & printed electronics. 

Conference Highlights:

(i)   Printed electronics applications with advanced materials including printed dielectric, conductors, graphene, etc.;

(ii)  Smart packaging, printed battery, printed memory, printed sensors and flexible displays;

(iii) Latest market trends, industry drivers and development of printed devices;

(iv) Business matching with printed electronics companies, materials suppliers, R&D institutes and users.


Date

22 November 2016

Time:

9:30 – 17:15

Venue:

Charles K. Kao Auditorium, Science Park

Organiser:  

Hong Kong Science and Technology Parks Corporation 

Event Website:    https://www.apacinnosummit.net/

Contact:  

+852-2629 6829/ This email address is being protected from spambots. You need JavaScript enabled to view it.

Registration:

Please click here


亞太創新峰會2016系列– 先進物料及印刷電子術

雲集來自業界及研究機構的主講嘉賓,這將是一個聚焦先進物料及印刷電子技術、探討新趨勢及機遇的前瞻性會議。

會議亮點:

(i)  印刷電子技術結合先進物料的應用,包括介質印刷、導體及石墨烯等;

(ii) 
智慧封裝、印刷電池、印刷記憶體、印刷傳感器又柔性顯示器;

(iii) 
市場最新趨勢,業界推動者及印刷設備的發展

(iv) 
特為印刷電子公司、物料供應商、科研機構及用戶而設之商業配對機會


日期:   

2016年11月22日

時間:

9:30 – 17:15  

地點

香港科學園高錕會議中心

主辦單位:

香港科技園公司

活動網站:

https://www.apacinnosummit.net/

聯絡方法:  

+852-2629 6829/ This email address is being protected from spambots. You need JavaScript enabled to view it.

報名:

請按此處