2016
APAC Innovation Summit 2016 Series – Advanced Materials & Printed Electronics
Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of advanced materials & printed electronics.
Conference Highlights:
Conference Highlights:
(i) Printed electronics applications with advanced materials including printed dielectric, conductors, graphene, etc.;
(ii) Smart packaging, printed battery, printed memory, printed sensors and flexible displays;
(iii) Latest market trends, industry drivers and development of printed devices;
(iv) Business matching with printed electronics companies, materials suppliers, R&D institutes and users.
| Date: |
22 November 2016 |
| Time: |
9:30 – 17:15 |
| Venue: |
Charles K. Kao Auditorium, Science Park |
| Organiser: |
Hong Kong Science and Technology Parks Corporation |
| Event Website: | https://www.apacinnosummit.net/ |
| Contact: |
+852-2629 6829/ This email address is being protected from spambots. You need JavaScript enabled to view it. |
| Registration: |
Please click here |
亞太創新峰會2016系列– 先進物料及印刷電子術
雲集來自業界及研究機構的主講嘉賓，這將是一個聚焦先進物料及印刷電子技術、探討新趨勢及機遇的前瞻性會議。
會議亮點：
(i) 印刷電子技術結合先進物料的應用，包括介質印刷、導體及石墨烯等;
(ii) 智慧封裝、印刷電池、印刷記憶體、印刷傳感器又柔性顯示器;
(iii) 市場最新趨勢，業界推動者及印刷設備的發展;
(iv) 特為印刷電子公司、物料供應商、科研機構及用戶而設之商業配對機會
| 日期: |
2016年11月22日 |
| 時間: |
9:30 – 17:15 |
| 地點: |
香港科學園高錕會議中心 |
| 主辦單位: |
香港科技園公司 |
| 活動網站: |
https://www.apacinnosummit.net/ |
| 聯絡方法: |
+852-2629 6829/ This email address is being protected from spambots. You need JavaScript enabled to view it. |
| 報名: |
請按此處 |