Funding disbursed directly to HK!

1. STIC is inviting applications from Hong Kong and Macau for the captioned funding scheme. The Scheme aims to support research collaborations among Shenzhen, Hong Kong and Macau, and to promote integration of industry-university-institute in Greater Bay Area. Interested colleagues please read the STIC’s announcement for details about the scheme as well as the application requirements.

2. Key Areas:

   • 物聯網、大數據、雲計算、人工智能、集成電路、新型顯示、信息安全、5G、量子信息、第三代半導體；
   • 醫藥生物技術、醫療器械、人口健康技術、水環境治理和生態修復、農業生物育種；
   • 石墨烯材料、先進電子信息材料、顯示材料、新能源材料、高性能高分子材料、氫能和燃料電池；
   • 機器人與智能裝備、智能無人系統、增材製造和激光製造
3. Project Fund:
   
   • Maximum project fund can reach RMB 3M*
   • The grantor will provide no more than 50% of the equipment costs of the research projects. Applicants shall be required to arrange for their own sources to meet the matching requirement.
   (*The awarded amount from grantor was RMB 1M in previous exercises. Matching fund arranged by applicants may be required. The list of awarded projects is available here.)
   
4. Maximum project duration could be 2 years.
5. Both Principal Investigator and project team members cannot hold or participate in more than 1 on-going project under深圳市深港澳科技計劃 or “深港創新圈”.
6. Applications should be submitted via the STIC’s electronic system (深圳市科技業務管理系統). For system account creation, please contact Grants Team, ORKTS by email (orkts_grants@cuhk.edu.hk).

7. Applicants please submit the following to Grants Team, ORKTS (orkts_grants@cuhk.edu.hk) by the internal deadline. Please note that late applications would not be accepted.
   
   a) Application Form, completed in Simplified Chinese, which should be a submitted version captured from the STIC ES (in PDF);
   b) Declaration form endorsed by Head of relevant academic unit via the new e-Declaration System (details available here);
   c) signed “深港澳科技計劃項目(C類項目)申報承諾書” and “科研誠信承諾書”(original copy);
   d) CUHK research ethics approval (if any) (in PDF).
   
   An acknowledgement email would be sent upon receipt of application materials.